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Platinum thin films are used in various microelectronic andmicro-sensor applications. The microstructural, chemical, and electricalstability of these films under high-temperature conditionsare of major concern. In addition, stability is also a concern forpotential extended use in specialized microelectronic applications,especially when the films are used as thin, two-dimensional interconnectsor electrodes connecting active components at elevatedtemperatures. Typical applications of these high-temperaturefilms are aligned with electrodes/interconnects for chemical sensors,micro-heaters and -hotplates within microelectromechanicalsystems (MEMS) [1–6]. Recently, more advanced MEM systemshave been applied within extreme environments, whichincludes high temperatures and harsh chemical reactants, such asmicro-chemical emission sensors, -structural monitoring sensors,-thermocouples, and -fuel cell systems that are utilized at temperatures>600–800 ◦C [7–13].High melting point noble metals are most suited for extremeenvironment applications. Platinum, with its relatively high meltingpoint (1773 ◦C) and excellent chemical inertness, has longbeen utilized for MEMs devices capable of operating at elevatedtemperatures. Pt and other noble metals have a great chemicalinertness; however, these metals show poor adhesion and high surfacetension toward oxide surfaces. Budhani et al. demonstrated aninterface modification between thermally grown aluminum oxide(Al2O3) and thin Pt films via reactive sputtering with low levelsof oxygen in order to obtain a 20–30 nm PtxO1−x layer prior topure platinum metal deposition. Adhesion tests showed a higherlevel of adhesion compared to the conventional Pt + Al2O3 couple.The authors indicated that strong PtxO1−x to Al2O3 bonding andinterdiffusion at the interface were responsible for the enhancedadhesion [14].
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