A frequently overlooked property of

A frequently overlooked property of solders is
wettability. Wettability is dened as the ten-
dency for a liquid metal to spread on a solid sur-
face [1]. It describes the solders ability to form
the actual joint on a circuit board. Joint forma-
tion includes llet development between vertical
and horizontal surfaces and capillary
ow by the
solder required to ll holes or gaps. A labora-
tory assessment of solder wettability can be used
to predict alloy performance for process develop-
ment in the subsequent prototype manufacturing
eorts [1].

Results (English) 2:

一个经常被忽视的特性是
焊料润湿性。润湿性是定义为十
dency的液态金属扩散在固体表面
脸[ 1 ]。它描述了焊料形成
电路板上的实际焊接接头的能力。联合形成了包括
让发展垂直
和水平面和毛细管
自己所需要的将漏洞或空白
焊料之间。一个实验室
保守党评价焊料的润湿性可以用
预测合金性能的工艺开发
以及随后的原型制造
E 运动
[ 1 ]。