Beware of SMD thick film resistor construction in regard to the method of inner layer nickel deposition and the silver termination.
The dipped type methods are inferior to the plated methods. The dipped types allow gaps that will expose inner
silver substrates to atmospheric sulphur compounds which can lead to corrosion and long term failures (opens). In addition,
the silver plating should be doped with palladium to retard the silver sulfide crystal growth. It is recommended that
thick film resistors of an anti-sulfuration design be used in potted applications.